Through-Hole Passive Components Market Outlook: Electronics Manufacturing Demand and Growth Opportunities

According to IMARC Group's latest research publication, The global through-hole passive components market size reached USD 41.1 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 67.5 Billion by 2033, exhibiting a growth rate (CAGR) of 5.22% during 2025-2033.

How AI is Reshaping the Future of Through-Hole Passive Components Market

• Predictive Defect Detection and Quality Inspection: AI-powered computer vision systems analyze thousands of component images per second, detecting microscopic defects and surface irregularities that human inspectors miss. Electronics assembly facilities have achieved 94% effectiveness in automated solder defect correction, eliminating manual intervention for common issues.
• Real-Time Production Monitoring and Process Control: Machine learning algorithms continuously analyze sensor data from manufacturing equipment to detect parameter deviations and adjust processes in real-time. AI systems predict equipment failures before breakdowns occur, reducing unplanned downtime by 30% and ensuring consistent output quality.
• Automated Testing and Reliability Analysis: AI-driven testing systems evaluate component performance across temperature ranges and stress conditions with superior speed and accuracy. Semiconductor fabs use artificial intelligence to anticipate lithography machine failures, maintaining production efficiency while reducing operational expenses.

Explore Updated 2026 Market Trends & Analysis

Through-Hole Passive Components Industry Overview:

Asia Pacific dominates the global market, driven by massive electronics manufacturing capacity, substantial government investments in semiconductor infrastructure, and growing automotive electrification. Japan leads in precision manufacturing technology through companies like Murata, TDK, and Kyocera, while China provides unmatched production scale. South Korea advances 5G millimeter-wave filter development, and regional MLCC production expansion continues with multi-billion dollar facility investments supporting automotive and industrial applications.

Through-Hole Passive Components Market Trends & Drivers

Electric vehicle adoption is transforming demand for through-hole passive components across automotive electronics. Global EV sales reached 17 million units in 2024, exceeding 20% of new car sales and driving component requirements for onboard chargers, DC-DC converters, and battery management systems. Chinese EV sales are projected to hit 14 million units in 2025, while North American penetration climbed to 10.36% through Q3. Each electric vehicle requires significantly more capacitors, resistors, and inductors than conventional vehicles, with high-voltage power electronics demanding components capable of withstanding extreme temperatures and mechanical stress throughout extended lifecycles.

Industrial automation and smart manufacturing are accelerating through-hole component integration in control systems, robotics, and sensor networks. Factories deploying Industry 4.0 technologies require rugged passive components for programmable logic controllers, motor drives, and industrial IoT devices operating in harsh environments with vibration, dust, and temperature fluctuations. The automation market expansion supports demand for components offering mechanical stability and long-term reliability. Additionally, renewable energy infrastructure including solar inverters, wind turbine control systems, and grid-tied battery storage requires high-power through-hole components capable of handling voltage surges and continuous operation under variable conditions.

5G network deployment and telecommunications infrastructure upgrades are driving specialized component requirements for base stations, power amplifiers, and signal processing equipment. Mobile network operators worldwide are installing millions of 5G base stations requiring high-frequency inductors, temperature-stable capacitors, and precision resistors. The telecommunications build-out combines with data center expansion fueled by cloud computing and artificial intelligence workloads, creating sustained demand for server power supplies and networking equipment incorporating through-hole components. IoT device proliferation further expands application scope as connected sensors, industrial monitors, and smart building systems integrate passive components for power management, signal conditioning, and environmental resilience.

Leading Companies Operating in the Global Through-Hole Passive Components Industry:

• Bourns Inc
• Cornell Dubilier
• KYOCERA AVX Components Corporation. (KYOCERA Corporation)
• Murata Manufacturing Co Ltd
• Nippon Chemi-Con Corporation
• Samsung Electro-Mechanics (Samsung Group)
• TDK Corporation.
• TE Connectivity
• TT Electronics Plc
• YAGEO Group

Through-Hole Passive Components Market Report Segmentation:

By Component:

• Resistors
• Capacitors
• Inductors
• Diodes
• Transducers
• Sensors
• Others

Capacitors dominate the market as they are essential for voltage smoothing, signal filtering, and energy storage across all electronic applications.

By Leads Model:

• Axial Leads
• Radial Leads

Axial leads represent the largest segment due to their traditional mounting configuration and widespread use in power circuits and legacy system designs.

By Application:

• Consumer Electronics
• IT and Telecommunication
• Automotive
• Industrial
• Aerospace and Defense
• Healthcare
• Others

Consumer electronics holds the largest market share owing to massive global production volumes of televisions, audio systems, gaming consoles, and home appliances requiring passive components.

Regional Insights:

• North America (United States, Canada)
• Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, Others)
• Europe (Germany, France, United Kingdom, Italy, Spain, Others)
• Latin America (Brazil, Mexico, Others)
• Middle East and Africa

Asia Pacific exhibits clear dominance in the through-hole passive components market due to concentrated electronics manufacturing, established supply chains, and ongoing investments in automotive and telecommunications infrastructure.

Recent News and Developments in Through-Hole Passive Components Market

• January 2023: Diodes Incorporated launched its first silicon carbide Schottky barrier diode series, including DSCxxA065 (650V rated) and DSCxx120 (1200V rated) products. These wide-bandgap components deliver significantly improved efficiency and high-temperature reliability for AC-DC converters, photovoltaic inverters, and industrial motor drives.
• July 2024: Murata Manufacturing announced plans for its JPY 46 billion Moriyama Innovation Center, scheduled to open in 2026. The facility will focus on next-generation passive component formulations and precision multilayer stacking technologies for automotive and industrial applications.
• July 2024: Global passive component manufacturers including Murata and TDK announced price increases up to 20% for multilayer inductors and ferrite beads. The adjustments reflected rising silver prices, recovering market demand, and normalized inventory levels following extended adjustment periods.
• January 2025: Murata Manufacturing acquired a stake in Sensoride to expand its sensor technology portfolio for navigation and condition-monitoring applications. The strategic investment strengthens capabilities in industrial automation and aerospace markets requiring integrated passive component solutions.
• December 2024: Teledyne completed USD 57.3 million acquisition of Micropac Industries, expanding its high-reliability optoelectronics catalog and hermetic packaging capabilities. The consolidation addresses growing aerospace and defense demand for ruggedized through-hole components with extended lifecycles.

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